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TDA3608TH/N3C,512-ND

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TDA3608TH/N3C,512
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供应商器件封装 20-HSOP
包装 管件
安装类型 表面贴装
封装/外壳 20-SOIC(0.433",11.00mm 宽)裸露焊盘
工作温度 -40°C ~ 85°C
应用 处理器
电压 - 电源 9.5 V ~ 18 V
电流 - 电源 500µA
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