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HI5805BIB-ND

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HI5805BIB
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PDF
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位数 12
供应商器件封装 28-SOIC W
功率耗散(最大值) 350mW
包装 管件
安装类型 表面贴装
封装/外壳 28-SOIC(0.295",7.50mm 宽)
工作温度 -40°C ~ 85°C
数据接口 并联
电压源 模拟和数字
系列 -
转换器数 3
输入数和类型 2 个单端,单极;1 个差分,双极
采样率(每秒) 5m
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