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220-1311-ND

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LFE3-150EA-9FN672C
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I/O 数 380
LAB/CLB 数 18625
供应商器件封装 672-FPBGA(27x27)
安装类型 表面贴装
封装/外壳 672-BBGA
工作温度 0°C ~ 85°C
总 RAM 位数 7014400
栅极数 -
电压 - 电源 1.14 V ~ 1.26 V
系列 ECP3
逻辑元件/单元数 149000
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