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MAX186CCWP+-ND

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MAX186CCWP+
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供应商器件封装 20-SOIC W
分辨率(位) 12 b
包装 管件
安装类型 表面贴装
封装/外壳 20-SOIC(0.295",7.50mm 宽)
工作温度 0°C ~ 70°C
数据接口 MICROWIRE™,QSPI™,串行,SPI™
电压 - 电源 ±5V
电压源 双 ±
类型 数据采集系统(DAS),ADC
系列 -
采样率(每秒) 133k
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